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DS1374
I2C, 32-Bit Binary Counter Watchdog RTC with
Trickle Charger and Reset Input/Output
2
_____________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED DC OPERATING CONDITIONS
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on VCC Pin Relative to Ground .....-0.3V to +6.0V
Voltage Range on SDA or SCL
Relative to Ground ....................................-0.3V to VCC + 0.3V
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
16-Pin SO .....................................................................73°C/W
10-Pin SOP ...............................................................221°C/W
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
16-Pin SO .....................................................................23°C/W
10-Pin SOP .................................................................39°C/W
Operating Temperature Range ...........................-40
°C to +85°C
Storage Temperature Range .............................-55
°C to +125°C
Lead Temperature (soldering, 10s) .................................+260
°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DS1374-33
2.97
3.3
5.50
DS1374-3
2.7
3.0
3.3
Supply Voltage
(Notes 3, 4)
VCC
DS1374-18
1.71
1.8
1.89
V
Input Logic 1
VIH
(Note 3)
0.7 x VCC
VCC + 0.3
V
Input Logic 0
VIL
(Note 3)
-0.3
+0.3 x
VCC
V
Pullup Resistor Voltage (INT,
SQW, SDA, SCL), VCC = 0V
VPU
(Note 3)
5.5
V
DS1374-33
2.70
2.88
2.97
DS1374-3
2.45
2.6
2.7
Power-Fail Voltage
(Note 3)
VPF
DS1374-18
1.51
1.6
1.71
V
DS1374-33
1.3
3.0
VCC
(MAX)
Backup Supply Voltage
(Notes 3, 4, 5)
VBACKUP
DS1374-3, DS1374-18
1.3
3.0
3.7
V
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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